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公开(公告)号：US11493793B2
公开(公告)日：2022-11-08
申请号：US16893472
申请日：2020-06-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC: H01L23/00 , H01L51/00 , G02F1/1333 , G02F1/1335 , G02F1/1362 , H01L27/32
Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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公开(公告)号：US11276674B2
公开(公告)日：2022-03-15
申请号：US16862934
申请日：2020-04-30
Inventor： Ke Meng , Chao Liu , Qiangwei Cui , Chuhang Wang , Lili Wang , Linhui Gong , Yutian Chu , Fan Yang
IPC: H01L27/118 , H01L25/075 , H01L27/12 , H01L33/62
Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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公开(公告)号：US11239198B2
公开(公告)日：2022-02-01
申请号：US16830834
申请日：2020-03-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Lili Wang , Haiwei Sun , Zhenxing Tang , Feng Qu , Jing Liu , Chao Liu , Chuhang Wang , Qiangwei Cui , Ke Meng , Linhui Gong
Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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4.发明申请公开(公告)号：US20240405179A1
公开(公告)日：2024-12-05
申请号：US18697192
申请日：2022-08-11
IPC: H01L33/62 , H01L25/075 , H01L33/40
Abstract: A display panel includes a substrate, first bonding electrodes, connecting leads, an electrode carrier plate and second bonding electrodes. The substrate includes a display surface, a non-display surface, and a selected side face. The display surface includes a first bonding area, and the non-display surface includes a second bonding area. The first bonding electrodes are arranged side by side at the intervals in the first bonding area. The connecting leads are arranged side by side at intervals, each connecting lead includes a first portion, a second portion and a third portion, and the first portion of each connecting lead is electrically connected to a first bonding electrode. The electrode carrier plate is arranged on the non-display surface and provided thereon with the second bonding electrodes arranged side by side at intervals, and each second bonding electrode is electrically connected to a third portion of a connecting lead.
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Patent Agency Ranking
公开(公告)号：US12230665B2
公开(公告)日：2025-02-18
申请号：US17264036
申请日：2020-06-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke Meng , Qiangwei Cui , Chao Liu , Lili Wang , Chuhang Wang , Yutian Chu , Linhui Gong
Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US12033882B2
公开(公告)日：2024-07-09
申请号：US17295036
申请日：2020-05-09
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Lili Wang , Chuhang Wang , Chao Liu , Qiangwei Cui , Ke Meng , Linhui Gong
IPC: H01L21/683 , H01L25/075 , H01L33/62
CPC classification number: H01L21/6835 , H01L25/0753 , H01L33/62 , H01L2221/68354 , H01L2221/68368 , H01L2933/0066
Abstract: A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.
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公开(公告)号：US20210088828A1
公开(公告)日：2021-03-25
申请号：US16893472
申请日：2020-06-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC: G02F1/1333 , H01L23/00 , H01L51/00 , H01L27/32 , G02F1/1335 , G02F1/1362
Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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公开(公告)号：US10395945B2
公开(公告)日：2019-08-27
申请号：US15647882
申请日：2017-07-12
Applicant: BOE Technology Group Co., Ltd.
IPC: B23K20/12 , H01L21/447 , H01L21/762 , H01L23/482 , H01L21/683 , H01L21/203 , H01L21/60
Abstract: The embodiments of the present disclosure provide a bonding device for a chip on film and a display panel and a bonding method for the same. The bonding device includes: a bearing stage having a horizontal bearing surface for supporting at least one row of display panels, wherein one row of the at least one row of display panels has a row of first bonding regions; a grasping unit disposed above the bearing stage and configured to grasp at least a partial area of the entire chip on film so that a row of second bonding regions of the entire chip on film is horizontally located above the one row of display panels; and a bonding unit configured to bond the row of second bonding regions which has been aligned with the row of first bonding regions to the row of first bonding regions.
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公开(公告)号：US20180053664A1
公开(公告)日：2018-02-22
申请号：US15647882
申请日：2017-07-12
Applicant: BOE Technology Group Co., Ltd.
IPC: H01L21/447 , H01L21/762 , H01L23/482 , H01L21/683 , H01L21/203 , B23K20/12
CPC classification number: H01L21/447 , B23K20/121 , H01L21/203 , H01L21/6838 , H01L21/76251 , H01L23/4828 , H01L2021/60187 , H01L2224/75
Abstract: The embodiments of the present disclosure provide a bonding device for a chip on film and a display panel and a bonding method for the same. The bonding device includes: a bearing stage having a horizontal bearing surface for supporting at least one row of display panels, wherein one row of the at least one row of display panels has a row of first bonding regions; a grasping unit disposed above the bearing stage and configured to grasp at least a partial area of the entire chip on film so that a row of second bonding regions of the entire chip on film is horizontally located above the one row of display panels; and a bonding unit configured to bond the row of second bonding regions which has been aligned with the row of first bonding regions to the row of first bonding regions.
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