Invention Grant
- Patent Title: Electronic device with delamination resistant wiring board
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Application No.: US16036084Application Date: 2018-07-16
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Publication No.: US10396031B2Publication Date: 2019-08-27
- Inventor: Hiroki Shibuya
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2016-172820 20160905; JP2017-019255 20170206
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/498 ; H01L23/522 ; H01L23/66 ; H05K1/02 ; H05K3/28 ; H05K1/14 ; H05K1/18
Abstract:
This invention provides an electronic device with improved reliability. The electronic device has a wiring board with a back-surface ground pattern formed at the back surface of the board. The back-surface ground pattern is provided with a notch overlapping a region of an upper wiring layer at which a board member is exposed and which is encircled by a wide pattern, the notch permitting the release of water vapor from the region.
Public/Granted literature
- US20180323140A1 ELECTRONIC DEVICE WITH DELAMINATION RESISTANT WIRING BOARD Public/Granted day:2018-11-08
Information query
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