- 专利标题: Method of fabricating 3-dimensional transistor sensor, the sensor and sensor array thereof
-
申请号: US15939721申请日: 2018-03-29
-
公开(公告)号: US10401320B2公开(公告)日: 2019-09-03
- 发明人: Young In Jhon , Young Tae Byun , Yong Tae Kim , Young Min Jhon
- 申请人: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- 申请人地址: KR Seoul
- 专利权人: Korea Institute of Science and Technology
- 当前专利权人: Korea Institute of Science and Technology
- 当前专利权人地址: KR Seoul
- 代理机构: Rabin & Berdo, P.C.
- 优先权: KR10-2017-0113361 20170905
- 主分类号: G01N27/414
- IPC分类号: G01N27/414 ; H01L29/66 ; H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L27/12
摘要:
Provided are a method of fabricating a 3-dimensional transistor sensor and the sensor and a sensor array thereof. The method of fabricating the 3-dimensional transistor sensor includes forming an insulating layer on a silicon substrate, forming a silicon layer on the insulating layer and forming a 3-dimensional silicon fin by etching the silicon layer, forming a source area and a source electrode at one end of the silicon fin, forming a drain area and a drain electrode at the other end the silicon fin, and forming a gate area at a center of the silicon fin, surrounding three surfaces of a gate with a gate insulating layer, forming a sensing gate layer configured to surround a portion of the gate insulating layer, and sealing an upper portion of the gate insulating layer excluding the sensing gate layer.
公开/授权文献
信息查询