Invention Grant
- Patent Title: Method of fabricating 3-dimensional transistor sensor, the sensor and sensor array thereof
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Application No.: US15939721Application Date: 2018-03-29
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Publication No.: US10401320B2Publication Date: 2019-09-03
- Inventor: Young In Jhon , Young Tae Byun , Yong Tae Kim , Young Min Jhon
- Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul
- Assignee: Korea Institute of Science and Technology
- Current Assignee: Korea Institute of Science and Technology
- Current Assignee Address: KR Seoul
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2017-0113361 20170905
- Main IPC: G01N27/414
- IPC: G01N27/414 ; H01L29/66 ; H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L27/12

Abstract:
Provided are a method of fabricating a 3-dimensional transistor sensor and the sensor and a sensor array thereof. The method of fabricating the 3-dimensional transistor sensor includes forming an insulating layer on a silicon substrate, forming a silicon layer on the insulating layer and forming a 3-dimensional silicon fin by etching the silicon layer, forming a source area and a source electrode at one end of the silicon fin, forming a drain area and a drain electrode at the other end the silicon fin, and forming a gate area at a center of the silicon fin, surrounding three surfaces of a gate with a gate insulating layer, forming a sensing gate layer configured to surround a portion of the gate insulating layer, and sealing an upper portion of the gate insulating layer excluding the sensing gate layer.
Public/Granted literature
- US20190072516A1 METHOD OF FABRICATING 3-DIMENSIONAL TRANSISTOR SENSOR, THE SENSOR AND SENSOR ARRAY THEREOF Public/Granted day:2019-03-07
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