Invention Grant
- Patent Title: Integrated circuit
-
Application No.: US14479561Application Date: 2014-09-08
-
Publication No.: US10403540B2Publication Date: 2019-09-03
- Inventor: Patrice Gamand , Olivier Tesson
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP13290215 20130911; EP14152005 20140121
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01Q1/48 ; H01L23/552 ; H01L23/64 ; H01L23/66 ; H01Q1/52 ; H05K1/02 ; H01L23/00
Abstract:
An integrated circuit for a packaged device is proposed. The circuit comprises: a circuit having first and second electromagnetic radiating elements fabricated on a die; a package substrate comprising an upper surface and a lower surface; and a grounding layer provided on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board. The die is mounted on the upper surface of the package substrate. The grounding layer comprises a void, at least a portion of the void being positioned so as to at least partially electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element.
Public/Granted literature
- US20150070240A1 INTEGRATED CIRCUIT Public/Granted day:2015-03-12
Information query
IPC分类:
