Invention Grant
- Patent Title: Method of fabricating packaging structure
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Application No.: US15949847Application Date: 2018-04-10
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Publication No.: US10403596B2Publication Date: 2019-09-03
- Inventor: Hsien-Wen Chen , Shih-Ching Chen , Chieh-Lung Lai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Indsutries Co., Ltd.
- Current Assignee: Siliconware Precision Indsutries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Leving Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103142115A 20141204
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/498 ; H01L21/683 ; H01L23/31 ; H01L21/56 ; H01L23/15

Abstract:
A package structure includes a dielectric layer having opposing first and second surfaces, a wiring layer formed on the first surface and having a plurality of conducive vias that penetrate the dielectric layer, an electronic component disposed on the first surface of the dielectric layer and electrically connected to the wiring layer, an encapsulant encapsulating the electronic component, and a packaging substrate disposed on the second surface and electrically connected to the conductive vias. With the dielectric layer in replacement of a conventional silicon board and the wiring layer as a signal transmission medium between the electronic component and the packaging substrate, the package structure does not need through-silicon vias. Therefore, the package structure has a simple fabrication process and a low fabrication cost. The present invention further provides a method of fabricating the package structure.
Public/Granted literature
- US20180233478A1 METHOD OF FABRICATING PACKAGING STRUCTURE Public/Granted day:2018-08-16
Information query
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