Invention Grant
- Patent Title: Memory device including a variable resistance material layer
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Application No.: US15832958Application Date: 2017-12-06
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Publication No.: US10403681B2Publication Date: 2019-09-03
- Inventor: Dong-ho Ahn , Zhe Wu , Soon-oh Park , Hideki Horii
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2017-0038666 20170327
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
A memory device is provided. The memory device includes a variable resistance layer. A selection device layer is electrically connected to the variable resistance layer. The selection device layer includes a chalcogenide switching material having a composition according to chemical formula 1 below, [GeASeBTeC](1-U)[X]U (1) where 0.20≤A≤0.40, 0.40≤B≤0.70, 0.05≤C≤0.25, A+B+C=1, 0.0≤U≤0.20, and X is at least one selected from boron (B), carbon (C), nitrogen (N), oxygen (O), phosphorus (P), or sulfur (S).
Public/Granted literature
- US20180277601A1 MEMORY DEVICE INCLUDING A VARIABLE RESISTANCE MATERIAL LAYER Public/Granted day:2018-09-27
Information query
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