- 专利标题： Conductive paste composition and semiconductor devices made therewith
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申请号： US15015245申请日： 2016-02-04
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公开(公告)号： US10403770B2公开(公告)日： 2019-09-03
- 发明人: Michael Stephen Wolfe , John Donald Summers , Bryan Benedict Sauer , Hoang Vi Tran , Brian D Mather , Hee Hyun Lee , Esther Kim , Ma Helen Cativo , Yuefei Tao
- 申请人： E I DU PONT DE NEMOURS AND COMPANY
- 申请人地址： US DE Wilmington
- 专利权人： E I DU PONT DE NEMOURS AND COMPANY
- 当前专利权人： E I DU PONT DE NEMOURS AND COMPANY
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; C09D5/24 ; H01B1/22 ; C03C8/16 ; C03C8/18 ; C03C17/04 ; C03C17/34 ; H01B1/16 ; H01L31/18 ; C03C8/14 ; C03C8/02 ; C03C8/22
摘要：
A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.
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