公开(公告)号：US10403770B2

公开(公告)日：2019-09-03

申请号：US15015245

申请日：2016-02-04

申请人： E I DU PONT DE NEMOURS AND COMPANY

发明人： Michael Stephen Wolfe ,  John Donald Summers ,  Bryan Benedict Sauer ,  Hoang Vi Tran ,  Brian D Mather ,  Hee Hyun Lee ,  Esther Kim ,  Ma Helen Cativo ,  Yuefei Tao

IPC分类号： H01L31/0224 ,  C09D5/24 ,  H01B1/22 ,  C03C8/16 ,  C03C8/18 ,  C03C17/04 ,  C03C17/34 ,  H01B1/16 ,  H01L31/18 ,  C03C8/14 ,  C03C8/02 ,  C03C8/22

摘要： A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.