Invention Grant
- Patent Title: EBG designs for mitigating radio frequency interference
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Application No.: US14258683Application Date: 2014-04-22
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Publication No.: US10403973B2Publication Date: 2019-09-03
- Inventor: Chung-Hao Chen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H01Q15/02
- IPC: H01Q15/02 ; H01Q1/52 ; H01Q1/24 ; H01Q15/00

Abstract:
An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.
Public/Granted literature
- US20150303562A1 EBG DESIGNS FOR MITIGATING RADIO FREQUENCY INTERFERENCE Public/Granted day:2015-10-22
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