Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
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Application No.: US15661921Application Date: 2017-07-27
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Publication No.: US10405428B2Publication Date: 2019-09-03
- Inventor: Shuichi Osawa , Yoshikatsu Imazeki , Yoichi Kamijo , Yoshihiro Watanabe
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2016-149609 20160729
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K3/00 ; H05K3/40 ; H05K3/36 ; G02F1/1339 ; G02F1/1333 ; G02F1/133 ; G02F1/1362

Abstract:
According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement which is disposed to be apart from the first conductive layer and includes a first surface opposed to the first conductive layer and a second surface opposite to the first surface, and a second conductive layer disposed on the second surface, the second substrate including a first hole passing through the second basement, and a connecting material passing through the first hole to electrically connect the first conductive layer and the second conductive layer, wherein the first hole is shaped as a funnel.
Public/Granted literature
- US20180035542A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-02-01
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