Invention Grant
- Patent Title: Electronic device
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Application No.: US15311927Application Date: 2014-06-04
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Publication No.: US10409340B2Publication Date: 2019-09-10
- Inventor: Linfang Jin , Xiaowei Hui , Xiangyang Yang , Shaoxin Zhou
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- International Application: PCT/CN2014/079149 WO 20140604
- International Announcement: WO2015/184603 WO 20151210
- Main IPC: G06F1/20
- IPC: G06F1/20 ; F28D15/02 ; H05K7/20

Abstract:
An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
Public/Granted literature
- US20170102745A1 Electronic Device Public/Granted day:2017-04-13
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