Invention Grant
- Patent Title: Computer subsystem and computer system with composite nodes in an interconnection structure
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Application No.: US15845450Application Date: 2017-12-18
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Publication No.: US10409766B2Publication Date: 2019-09-10
- Inventor: Jiangen Liu , Chenghong He , Haibin Wang , Xinyu Hou
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Main IPC: G06F9/30
- IPC: G06F9/30 ; G06F15/80 ; G06F15/173 ; G06F15/167 ; G06F13/42

Abstract:
A computer subsystem and a computer system, where the computer subsystem includes L composite nodes (CNs), each CN includes M basic nodes, each basic node includes N central processing units (CPUs) and one node controller (NC). Any two CPUs in each basic node are interconnected. Each CPU in each basic node is connected to the NC in the basic node. The NC in each basic node has a routing function. Any two NCs in the M basic nodes are interconnected. A connection between the L CNs formed through connections between NCs enables communication between any two NCs to be no more than three hops. Hence, the computer subsystem and the computer system can reduce the kinds and the number of interconnection chips, and simplify an interconnection structure of a system, thereby improving reliability of the system.
Public/Granted literature
- US20180107628A1 Computer Subsystem and Computer System with Composite Nodes in an Interconnection Structure Public/Granted day:2018-04-19
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