Invention Grant
- Patent Title: Coil module
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Application No.: US15276888Application Date: 2016-09-27
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Publication No.: US10410782B2Publication Date: 2019-09-10
- Inventor: Yoshihito Otsubo , Norio Sakai , Mitsuyoshi Nishide , Shinichiro Banba
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2014-069063 20140328
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/28 ; H01F17/00 ; H01F17/06 ; H05K1/18

Abstract:
A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.
Public/Granted literature
- US20170018349A1 COIL MODULE Public/Granted day:2017-01-19
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