公开(公告)号：US11164695B2

公开(公告)日：2021-11-02

申请号：US15809208

申请日：2017-11-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Shinichiro Banba ,  Mitsuyoshi Nishide ,  Norio Sakai ,  Haruhiko Mori

IPC: H01F27/32 ,  H01F17/00 ,  H01F27/28 ,  H01F27/24

Abstract: A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

公开(公告)号：US10912188B2

公开(公告)日：2021-02-02

申请号：US15464851

申请日：2017-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Norio Sakai ,  Tetsuya Kanagawa

IPC: H01F5/00 ,  H05K1/02 ,  H01F27/40 ,  H01F17/04 ,  H05K1/11 ,  H01F27/255 ,  H01F27/28 ,  H05K1/16 ,  H05K1/18 ,  H05K3/34

Abstract: A high-frequency component includes a resin layer and a high-frequency circuit provided in and on the resin layer and includes an inductor and an electronic component. The electronic component is arranged on an upper surface of the resin layer. The inductor includes first and second metal pins provided such that upper end surfaces thereof are exposed from the upper surface of the resin layer and lower end surfaces thereof are exposed from a lower surface of the resin layer. The electronic component has a first outer electrode provided at a position superposed with the upper end surface of the first metal pin in plan view and is connected to the first metal pin, and a second outer electrode provided at a position superposed with the upper end surface of the second metal pin in plan view and is connected to the second metal pin.

公开(公告)号：US10886059B2

公开(公告)日：2021-01-05

申请号：US15371305

申请日：2016-12-07

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoshihito Otsubo ,  Junji Kurobe ,  Norio Sakai

IPC: H01F27/29 ,  H01F17/06 ,  H01F17/00 ,  H01F27/24 ,  H01F27/28

Abstract: A coil component 1a includes an insulation layer 2 in which a magnetic body core 3 is embedded; a coil electrode 4 wound around the magnetic body core 3; and an input metal pin 5a and an output metal pin 5b for external connection whose lower end surfaces are respectively provided being exposed from the insulation layer 2 in a state of the input and output metal pins 5a and 5b being provided upright in a thickness direction of the insulation layer 2. The coil electrode 4 includes a plurality of coil metal pins 4a and 4b that are arranged around the magnetic body core 3 in a state of being provided upright in the thickness direction of the insulation layer 2, and the input metal pin 5a and the output metal pin 5b are formed to be larger in diameter than the coil metal pins 4a and 4b.

公开(公告)号：US10418168B2

公开(公告)日：2019-09-17

申请号：US15998734

申请日：2018-08-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Mitsuyoshi Nishide ,  Norio Sakai

IPC: H05K1/00 ,  H01F27/29 ,  H01F41/04 ,  H01F27/24 ,  H01F27/28 ,  H05K1/18 ,  H05K3/30 ,  H01F17/00 ,  H05K1/16

Abstract: A small-sized inductor with desired characteristics is provided. An inductor 1a includes a resin layer 3 and an inductor electrode 6, which includes an inner winding portion 6a and an outer winding portion 6b. The inner winding portion 6a and the outer winding portion 6b forming the inductor electrode 6 include the metal pins 7a to 7d and the wiring boards 8a to 8d. Here, the inner winding portion 6a and the outer winding portion 6b include the metal pins 7a to 7d and the wiring boards 8a to 8d, which have lower specific resistance than conductive paste or plating. This structure thus can reduce the resistance of the entirety of the inductor electrode 6, and improve the characteristics of the inductor 1a. The inductor 1a can reduce its size by including the inductor electrode 6 wound to have a multiplex winding structure.

公开(公告)号：US10410782B2

公开(公告)日：2019-09-10

申请号：US15276888

申请日：2016-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Norio Sakai ,  Mitsuyoshi Nishide ,  Shinichiro Banba

IPC: H01F27/24 ,  H01F27/28 ,  H01F17/00 ,  H01F17/06 ,  H05K1/18

Abstract: A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.

公开(公告)号：US10056311B2

公开(公告)日：2018-08-21

申请号：US15655070

申请日：2017-07-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Muneyoshi Yamamoto ,  Norio Sakai

IPC: H01L29/40 ,  H01L23/52 ,  H01L23/48 ,  H01L23/14 ,  H05K1/18 ,  H01L23/495 ,  H01L23/28 ,  H01L29/41 ,  H01L23/498

CPC classification number: H01L23/14 ,  H01L21/561 ,  H01L23/13 ,  H01L23/28 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49572 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/52 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/97 ,  H01L29/41 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/188 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

公开(公告)号：US20170213638A1

公开(公告)日：2017-07-27

申请号：US15481914

申请日：2017-04-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Shinichiro Banba ,  Mitsuyoshi Nishide ,  Norio Sakai

IPC: H01F27/29 ,  H01F27/28

CPC classification number: H01F27/29 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/292

Abstract: An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode.

公开(公告)号：US11075029B2

公开(公告)日：2021-07-27

申请号：US15372715

申请日：2016-12-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichiro Banba ,  Yoshihito Otsubo ,  Norio Sakai ,  Mitsuyoshi Nishide

IPC: H01F27/28 ,  H01F17/06 ,  H01F17/00 ,  H01F27/29

Abstract: Substrate-side wiring electrode patterns 16, which form a part of a coil electrode 12, are provided on a wiring substrate 20, and as a result reductions in the size and profile of a resin insulating layer 31, in which a coil core 11 is buried, can be achieved. Therefore, reductions in the size and the profile of a coil module 1 can be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns 16, which form a part of the coil electrode 12, are provided on the wiring substrate 20, the heat generated by a coil 10 can be efficiently released from the substrate-side wiring electrode patterns 16 to the wiring substrate 20. Therefore, the heat dissipation property of the coil module 1 can be improved at low cost.

公开(公告)号：US10726988B2

公开(公告)日：2020-07-28

申请号：US15461981

申请日：2017-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Shinichiro Banba ,  Norio Sakai

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/29 ,  H01F17/00 ,  H01F41/04

Abstract: A technique capable of reducing the resistance of an inductor electrode is provided. A second conductor 6 is constituted by an undercoating layer 11 formed of a conductive paste, and a plating layer 12 formed to cover the undercoating layer 11. Therefore, the second conductor 6 constituting part of the inductor electrode 7 can be formed at a lower cost. Respective first end surfaces 8a and 9a of first and second metal pins 8 and 9 are connected to each other by the plating layer 12 of the second conductor 6 without interposition of the undercoating layer 11 thereof between them. Hence the resistance of the inductor electrode 7 can be reduced at a lower cost.

公开(公告)号：US09226400B2

公开(公告)日：2015-12-29

申请号：US13734266

申请日：2013-01-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masato Nomiya ,  Norio Sakai ,  Mitsuyoshi Nishide

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/16 ,  H01R4/58 ,  H05K7/10 ,  H05K1/18 ,  H01L21/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/00 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/4626 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured.

Abstract translation: 在多层陶瓷电子器件的制造方法中，包括层叠的未烧结的陶瓷基材层的多层陶瓷元件组件，第一导体图案，配置在所述多层陶瓷元件组件的表面的座部， 设置在其上，连接到表面安装电子设备的第二导体图案，以及位于表面安装电子设备的垂直投影区域外部并且布置成将树脂引入座部的树脂引入部分。 烧结多层陶瓷元件组件，并且表面安装电子器件安装在烧制的多层陶瓷元件组件的座部上，其间具有第二导体图案。 树脂从树脂引入部分填充到座椅部分中，并且在座椅部分和表面安装电子装置之间填充并固化。