- Patent Title: Solder bond site including an opening with discontinuous profile
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Application No.: US15847687Application Date: 2017-12-19
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Publication No.: US10410882B2Publication Date: 2019-09-10
- Inventor: Jaspreet S. Gandhi , Dale Arnold
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; C23C18/32 ; H01L23/00
Abstract:
Apparatuses and methods for formation of a bond site including an opening with a discontinuous profile are disclosed herein. An example apparatus may at least include a substrate, a contact on the substrate, and a mask layer formed on the substrate and at least a portion of the contact. The mask layer may also include an opening formed therein, with the opening having a discontinuous profile from a top surface of the mask layer to the contact.
Public/Granted literature
- US20190074194A1 SOLDER BOND SITE INCLUDING AN OPENING WITH DISCONTINUOUS PROFILE Public/Granted day:2019-03-07
Information query
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