A light emitting device includes a light emitting element and a resin package including a molded body, a first lead, and a second lead. Each of the first lead and the second lead has a groove overlapped with a front surface of the molded body in a height direction along a height of the light emitting device. The groove includes a first groove portion extending along a first lateral surface of the molded body and having a first groove length along the first lateral surface, and a second groove portion extending along a second lateral surface of the molded body and having a second groove length along the second lateral surface. The second lateral surface is opposite to the first lateral surface in a first lateral direction perpendicular to the height direction. The second groove length is shorter than the first groove length.