Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15872073Application Date: 2018-01-16
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Publication No.: US10424675B2Publication Date: 2019-09-24
- Inventor: Hiroki Ohara
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2017-025200 20170214
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/02 ; H01L21/321 ; H01L29/66 ; H01L27/12

Abstract:
A semiconductor device includes an oxide semiconductor layer above an insulating surface, a source electrode in contact with a side surface of the oxide semiconductor layer, a drain electrode in contact with a side surface of the oxide semiconductor layer, a gate insulating film above the oxide semiconductor layer, the source electrode, and the drain electrode, and, a gate electrode overlapping with the oxide semiconductor layer interposed by the gate insulating film. The gate electrode is arranged above and outside of the source electrode and the drain electrode.
Public/Granted literature
- US20180233595A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-08-16
Information query
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