Invention Grant
- Patent Title: Multilayer down-converting encapsulant films and electronic devices including the same
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Application No.: US15032168Application Date: 2013-11-04
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Publication No.: US10424682B2Publication Date: 2019-09-24
- Inventor: John A. Naumovitz , Hongyu Chen , Yan Huang , Ada Yu Zhang , Zhi Xu
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland US PA Philadelphia
- Assignee: DOW GLOBAL TECHNOLOGIES LLC,ROHM AND HAAS COMPANY
- Current Assignee: DOW GLOBAL TECHNOLOGIES LLC,ROHM AND HAAS COMPANY
- Current Assignee Address: US MI Midland US PA Philadelphia
- Agency: Husch Blackwell LLP
- International Application: PCT/CN2013/086510 WO 20131104
- International Announcement: WO2015/062108 WO 20150507
- Main IPC: H01L31/055
- IPC: H01L31/055 ; B32B27/08 ; C09K11/06 ; H01L31/048 ; C09K11/02 ; B32B27/18 ; B32B27/32 ; B32B27/20 ; B32B27/30 ; H01L31/0296 ; H01L31/032

Abstract:
A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.
Public/Granted literature
- US20160260857A1 Multilayer Down-Converting Encapsulant Films and Electronic Devices Including the Same Public/Granted day:2016-09-08
Information query
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