发明授权
- 专利标题: Elastic wave device, high frequency front-end circuit, and communication apparatus
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申请号: US15922955申请日: 2018-03-16
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公开(公告)号: US10425116B2公开(公告)日: 2019-09-24
- 发明人: Akira Konno , Masakazu Mimura
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2015-208923 20151023
- 主分类号: H03H3/10
- IPC分类号: H03H3/10 ; H03H9/02 ; H03H9/10 ; H03H9/25 ; H03H9/64 ; H04B1/10 ; H03H9/145 ; H01L41/047
摘要:
An elastic wave device includes a LiNbO3 substrate, an IDT electrode provided on the LiNbO3 substrate, and a dielectric film that is provided on the LiNbO3 substrate so as to cover the IDT electrode and includes a projection on an upper surface of the stated dielectric film. A main mode of an elastic wave excited by the IDT electrode uses a Rayleigh wave, and a thickness of the IDT electrode is set such that a frequency at which a response by an SH wave appears is lower than a resonant frequency of the Rayleigh wave.
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