Invention Grant
- Patent Title: Test circuit, test method, array substrate and manufacturing method thereof
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Application No.: US15841911Application Date: 2017-12-14
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Publication No.: US10429412B2Publication Date: 2019-10-01
- Inventor: Yucheng Chan , Dong Li , Bin Zhang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Fay Sharpe LLP
- Priority: CN201710210639 20170331
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/317 ; G01R31/26 ; G01R3/00

Abstract:
A test circuit, a test method, an array substrate and a manufacturing method thereof are provided. The test circuit includes a plurality of to-be-tested units and plurality of test electrodes connected to the to-be-tested units. The plurality of to-be-tested units are arranged in a matrix. At least one of the test electrodes is multiplexed by the plurality of to-be-tested units in a row direction and at least one of the test electrodes is multiplexed by the plurality of to-be-tested units in a column direction.
Public/Granted literature
- US20180284153A1 TEST CIRCUIT, TEST METHOD, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-10-04
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