Invention Grant
- Patent Title: Laser component
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Application No.: US15654136Application Date: 2017-07-19
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Publication No.: US10431954B2Publication Date: 2019-10-01
- Inventor: Jan Seidenfaden , Jan Marfeld , Hubert Schmid , Soenke Tautz , Roland Enzmann
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: DE102016113470 20160721
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/022 ; H01S5/024 ; H01S5/40

Abstract:
A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.
Public/Granted literature
- US20180026421A1 LASER COMPONENT Public/Granted day:2018-01-25
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