Invention Grant
- Patent Title: Loudspeaker module
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Application No.: US15577169Application Date: 2015-11-13
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Publication No.: US10433038B2Publication Date: 2019-10-01
- Inventor: Tao Su , Jun Zhang , Chengfei Zhang
- Applicant: Goertek Inc.
- Applicant Address: CN Weifang, Shandong
- Assignee: GOERTEK, INC.
- Current Assignee: GOERTEK, INC.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Arent Fox, LLP
- Priority: CN201510354365 20150624
- International Application: PCT/CN2015/094517 WO 20151113
- International Announcement: WO2016/206286 WO 20161229
- Main IPC: H04R9/06
- IPC: H04R9/06 ; H04R1/02 ; H04R3/00 ; H04R1/28 ; H04R9/02 ; H04R31/00

Abstract:
Disclosed is a loudspeaker module, which comprises a loudspeaker unit and a module housing for accommodating the loudspeaker unit. The loudspeaker unit comprises a magnetic circuit assembly and a vibration assembly. The module housing comprises a polycarbonate plastic material layer and an elastomeric material layer having a compression amount. The polycarbonate plastic material layer forms an inner layer of the module housing. The elastomeric material layer is at least partially bonded on the outside of the polycarbonate plastic material layer to form the outer layer of the module housing. The polycarbonate plastic material layer and the elastomeric material layer are formed by double-shot injection molding. The loudspeaker module of the present disclosure can effectively solve the problem of the damage to the module housing caused by inflexible contact with other components of the whole machine, and can utilize the outer layer structure to change the resonance frequency, thereby effectively ameliorating the resonance phenomenon of the module housing and optimizing the product performance.
Public/Granted literature
- US20180184184A1 LOUDSPEAKER MODULE Public/Granted day:2018-06-28
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