Invention Grant
- Patent Title: MEMS multi-module assembly, manufacturing method and electronics apparatus
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Application No.: US15772576Application Date: 2015-11-03
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Publication No.: US10433042B2Publication Date: 2019-10-01
- Inventor: Quanbo Zou
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Alston & Bird LLP
- International Application: PCT/CN2015/093730 WO 20151103
- International Announcement: WO2017/075764 WO 20170511
- Main IPC: H04R1/04
- IPC: H04R1/04 ; H01L25/00 ; H04R19/04 ; G01L9/00 ; G01L19/00 ; H04R19/00 ; B81B7/00 ; B81B7/02
Abstract:
A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.
Public/Granted literature
- US20180324510A1 MEMS MULTI-MODULE ASSEMBLY, MANUFACTURING METHOD AND ELECTRONICS APPARATUS Public/Granted day:2018-11-08
Information query
