A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.