Invention Grant
- Patent Title: Multi-gate high electron mobility transistors and methods of fabrication
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Application No.: US15329216Application Date: 2014-09-09
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Publication No.: US10439057B2Publication Date: 2019-10-08
- Inventor: Kimin Jun , Sansaptak Dasgupta , Alejandro X. Levander , Patrick Morrow
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2014/054823 WO 20140909
- International Announcement: WO2016/039733 WO 20160317
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/423 ; H01L29/20 ; H01L29/66 ; H01L21/762

Abstract:
A multi-gate high electron mobility transistor (HEMT) and its methods of formation are disclosed. The multi-gate HEMT includes a substrate and an adhesion layer on top of the substrate. A channel layer is disposed on top of the adhesion layer, and a first gate electrode is disposed on top of the channel layer. The first gate electrode has a first gate dielectric layer in between the first gate electrode and the channel layer. A second gate electrode is embedded within the substrate and beneath the channel layer. The second gate electrode has a second gate dielectric layer completely surrounding the second gate electrode. A pair of source and drain contacts are disposed on opposite sides of the first gate electrode.
Public/Granted literature
- US20170229565A1 MULTI-GATE HIGH ELECTRON MOBILITY TRANSISTORS AND METHODS OF FABRICATION Public/Granted day:2017-08-10
Information query
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