Invention Grant
- Patent Title: Display substrate and manufacturing method thereof, and display device
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Application No.: US15767883Application Date: 2017-09-29
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Publication No.: US10444579B2Publication Date: 2019-10-15
- Inventor: Xiaoyuan Wang , Yan Fang , Kui Zhang , Zhicai Xu , Ming Deng
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chongqing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chongqing
- Priority: CN201710142159 20170310
- International Application: PCT/CN2017/104432 WO 20170929
- International Announcement: WO2018/161549 WO 20180913
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; H01L27/12 ; G02F1/1333 ; G02F1/1362 ; G02F1/1368

Abstract:
A display substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of the display substrate includes: forming an insulation layer on a base substrate, the base substrate including a display area and a peripheral area; and forming a planarization film on the insulation layer; performing a patterning process to the planarization film to form a planarization layer with a first thickness in the display area, a planarization layer with a second thickness in the peripheral area, and a first via hole in the planarization layer with the second thickness, the second thickness being less than the first thickness, and performing an etching process on the peripheral area to thin or remove the planarization layer is with the second thickness, and forming a second via hole corresponding to the first via hole in the insulation layer.
Public/Granted literature
- US20190094598A1 DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE Public/Granted day:2019-03-28
Information query
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