Invention Grant
- Patent Title: Interlevel connectors in multilevel circuitry, and method for forming the same
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Application No.: US15289231Application Date: 2016-10-10
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Publication No.: US10446437B2Publication Date: 2019-10-15
- Inventor: Chin-Cheng Yang
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/768 ; G11C16/08 ; H01L23/522 ; H01L23/528 ; H01L27/11524 ; H01L27/11529 ; H01L27/11556 ; H01L27/1157 ; H01L27/11573 ; H01L27/11582 ; H01L27/11548 ; H01L27/11575 ; H01L27/11526

Abstract:
Multilevel circuitry such as a a 3D memory array, has a set of contact regions arranged around a perimeter of a multilevel region, in which connection is made to circuit elements in a number W levels. Each of the contact regions has a number of steps having landing areas thereon, including steps on up to a number M levels, where the number M can be much less than W. A combination of contact regions provides landing areas on all of the W levels, each of the contact regions in the combination having landing areas on different subsets of the W levels. A method of forming the device uses an etch-trim process to form M levels in all of the contact regions, and one or more anisotropic etches in some of the contact regions.
Public/Granted literature
- US20180102281A1 INTERLEVEL CONNECTORS IN MULTILEVEL CIRCUITRY, AND METHOD FOR FORMING THE SAME Public/Granted day:2018-04-12
Information query
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