Invention Grant
- Patent Title: Semiconductor substrate and semiconductor packaging device, and method for forming the same
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Application No.: US15450598Application Date: 2017-03-06
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Publication No.: US10446515B2Publication Date: 2019-10-15
- Inventor: Li Chuan Tsai , Chih-Cheng Lee
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L21/48
Abstract:
A semiconductor substrate includes a first dielectric layer, a first patterned conductive layer disposed in the first dielectric layer, a second dielectric layer disposed on the first dielectric layer, and a first bump pad disposed in the second dielectric layer. The first bump pad is electrically connected to the first patterned conductive layer, and the first bump pad has a curved surface surrounded by the second dielectric layer.
Public/Granted literature
- US20180254240A1 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGING DEVICE, AND METHOD FOR FORMING THE SAME Public/Granted day:2018-09-06
Information query
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