Invention Grant
- Patent Title: Moldable adhesive wafers
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Application No.: US14907166Application Date: 2014-05-23
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Publication No.: US10449082B2Publication Date: 2019-10-22
- Inventor: Kenneth Johnsen
- Applicant: ConvaTec Technologies Inc.
- Applicant Address: US NV Las Vegas
- Assignee: CONVATEC TECHNOLOGIES INC.
- Current Assignee: CONVATEC TECHNOLOGIES INC.
- Current Assignee Address: US NV Las Vegas
- Agency: Wilson Sonsini Goodrich & Rosati
- International Application: PCT/US2014/039432 WO 20140523
- International Announcement: WO2015/012953 WO 20150129
- Main IPC: A61F5/443
- IPC: A61F5/443 ; A61F5/448 ; A61F5/445 ; A61L24/00 ; A61F13/02

Abstract:
Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.
Public/Granted literature
- US20160151197A1 MOLDABLE ADHESIVE WAFERS Public/Granted day:2016-06-02
Information query
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