Moldable adhesive wafers
    1.
    发明授权

    公开(公告)号:US10449082B2

    公开(公告)日:2019-10-22

    申请号:US14907166

    申请日:2014-05-23

    Inventor: Kenneth Johnsen

    Abstract: Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.

    MOLDABLE ADHESIVE WAFERS
    2.
    发明申请
    MOLDABLE ADHESIVE WAFERS 审中-公开
    可塑胶粘剂

    公开(公告)号:US20160151197A1

    公开(公告)日:2016-06-02

    申请号:US14907166

    申请日:2014-05-23

    Inventor: Kenneth Johnsen

    Abstract: Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.

    Abstract translation: 本文公开了用于联接和固定医疗装置器具的方法和装置。 特别地,公开了一种可成型的粘合剂结构,其允许将附着晶片定制成例如造口的尺寸和形状,同时允许将医疗装置(例如造口袋或其它装置)附接到柔性和安全性 主题。

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