Invention Grant
- Patent Title: Capacitor manufacturing method
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Application No.: US16329845Application Date: 2017-08-16
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Publication No.: US10453611B2Publication Date: 2019-10-22
- Inventor: Michihiro Hatanaka , Daizo Takahashi
- Applicant: MEIDENSHA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MEIDENSHA CORPORATION
- Current Assignee: MEIDENSHA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2016-171406 20160902
- International Application: PCT/JP2017/029420 WO 20170816
- International Announcement: WO2018/043126 WO 20180308
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G4/232 ; H01G13/00 ; H01G4/02 ; B23K1/00

Abstract:
Disclosed is a method for manufacturing a vacuum capacitor (1) provided with an insulating pipe (2), terminal electrodes (3, 4) that are disposed at open ends of the insulating pipe (2), and spiral electrodes (5, 6) that are connected to the terminal electrodes (3, 4). An electrode plate (7) and a spacer (8) are wound on a core member (9) to prepare a spiral electrode (5), and an electrode plate (10) and a spacer (8) are wound on a core member (11) to prepare a spiral electrode (6). A linear brazing material (12) is disposed in a groove (3c) formed in a surface of the terminal electrode (3) on an inner side of the insulating pipe (2). A platy brazing material (13) is sandwiched between the terminal electrode (3) and the spiral electrode (5) to fix the spiral electrode (5) to the terminal electrode (3). The insulating pipe (2) and the spiral electrode (6) are placed on the terminal electrode (4), and the terminal electrode (3) is disposed on the insulating pipe (2), thereby temporarily assembling the vacuum capacitor (1). The vacuum capacitor (1) is put into a vacuum heating furnace, and the terminal electrode (3) and the spiral electrode (5), the terminal electrode (4) and the spiral electrode (6), and the insulating pipe (2) and the terminal electrodes (3, 4) are respectively brazed.
Public/Granted literature
- US20190244759A1 CAPACITOR MANUFACTURING METHOD Public/Granted day:2019-08-08
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