Invention Grant
- Patent Title: Radio die package with backside conductive plate
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Application No.: US14909939Application Date: 2015-03-19
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Publication No.: US10453804B2Publication Date: 2019-10-22
- Inventor: Telesphor Kamgaing , Thorsten Meyer
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2015/021569 WO 20150319
- International Announcement: WO2016/148726 WO 20160922
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/498 ; H01L23/552 ; H01L23/00 ; H01L23/36 ; H01L23/66 ; H01L25/10 ; H01L21/48 ; H01L21/56 ; H01L25/065 ; H01Q1/22 ; H01Q1/24 ; H01Q1/38 ; H01L23/538
Abstract:
A package is described for a radio frequency die that has a backside conductive plate. One example includes a conductive plate, a semiconductor die having a front side and a back side, the back side being attached to the plate, a radio frequency component attached to the plate, a dielectric filled cavity in the plate adjacent to the radio frequency component, and a redistribution layer attached to the front side of the die for external connection.
Public/Granted literature
- US20170062357A1 RADIO DIE PACKAGE WITH BACKSIDE CONDUCTIVE PLATE Public/Granted day:2017-03-02
Information query
IPC分类:
