Invention Grant
- Patent Title: Substrate with conductive film
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Application No.: US15666038Application Date: 2017-08-01
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Publication No.: US10453891B2Publication Date: 2019-10-22
- Inventor: Takeshi Tomizawa , Yuki Aoshima , Reo Usui , Hidefumi Odaka
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-020414 20150204
- Main IPC: H01L27/146
- IPC: H01L27/146 ; B32B7/02 ; B32B9/00 ; H01B5/14 ; H05K1/02 ; H01L51/00 ; C01G9/02 ; C01G15/00 ; C01G19/02 ; C08F14/26 ; C08G63/183 ; C08G64/02

Abstract:
A substrate with conductive film includes a base material; and a film of a conductive metal oxide arranged on an upper part of the base material. The film includes, by a top plan view, a first region and a second region, the second region is configured of a same material as the first region, and an electric resistance of the second region is higher than an electric resistance of the first region. The second region includes a part configured by a plurality of cellular sections surrounded by a plurality of fine cracks. In the part, each fine crack has a width of 1 nm to 50 nm, and each cellular section has a largest measure of less than 10 μm.
Public/Granted literature
- US20170330913A1 SUBSTRATE WITH CONDUCTIVE FILM Public/Granted day:2017-11-16
Information query
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