Invention Grant
- Patent Title: Semiconductor device including nitride insulating layer and method for manufacturing the same
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Application No.: US15874227Application Date: 2018-01-18
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Publication No.: US10453927B2Publication Date: 2019-10-22
- Inventor: Toshinari Sasaki , Takashi Hamochi , Toshiyuki Miyamoto , Masafumi Nomura , Junichi Koezuka , Kenichi Okazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2012-147703 20120629
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/24

Abstract:
In a transistor including an oxide semiconductor film, movement of hydrogen and nitrogen to the oxide semiconductor film is suppressed. Further, in a semiconductor device using a transistor including an oxide semiconductor film, a change in electrical characteristics is suppressed and reliability is improved. A transistor including an oxide semiconductor film and a nitride insulating film provided over the transistor are included, and an amount of hydrogen molecules released from the nitride insulating film by thermal desorption spectroscopy is less than 5×1021 molecules/cm3, preferably less than or equal to 3×1021 molecules/cm3, more preferably less than or equal to 1×1021 molecules/cm3, and an amount of ammonia molecules released from the nitride insulating film by thermal desorption spectroscopy is less than 1×1022 molecules/cm3, preferably less than or equal to 5×1021 molecules/cm3, more preferably less than or equal to 1×1021 molecules/cm3.
Public/Granted literature
- US20180145138A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-05-24
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