Invention Grant
- Patent Title: Modular cooling
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Application No.: US15511983Application Date: 2014-09-30
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Publication No.: US10455726B2Publication Date: 2019-10-22
- Inventor: Tahir Cader , John P Franz , David Allen Moore , Douglas Kent Garday , Wade D Vinson
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2014/058205 WO 20140930
- International Announcement: WO2016/053273 WO 20160407
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
Public/Granted literature
- US20170295667A1 MODULAR COOLING Public/Granted day:2017-10-12
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