Invention Grant
- Patent Title: Rack enclosure with perforations for cooling
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Application No.: US15564826Application Date: 2015-04-17
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Publication No.: US10455741B2Publication Date: 2019-10-22
- Inventor: Dave Mayer , Arlen L. Roesner
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2015/026465 WO 20150417
- International Announcement: WO2016/167804 WO 20161020
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consumed by the side plenums may be available to accommodate a chassis of a substantial volume. The chassis may expand a substantial width of the rack enclosure to house an enlarged or a maximum number of computing components within the rack enclosure.
Public/Granted literature
- US20180110154A1 RACK ENCLOSURE WITH PERFORATIONS FOR COOLING Public/Granted day:2018-04-19
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