公开(公告)号：US10324506B2

公开(公告)日：2019-06-18

申请号：US15579921

申请日：2015-06-05

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Dave Mayer ,  Steven E. Hanzlik

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  H01L23/427

Abstract: In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.

公开(公告)号：US20180110154A1

公开(公告)日：2018-04-19

申请号：US15564826

申请日：2015-04-17

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Dave Mayer ,  Arlen L. Roesner

IPC: H05K7/20

Abstract: The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consumed by the side plenums may be available to accommodate a chassis of a substantial volume. The chassis may expand a substantial width of the rack enclosure to house an enlarged or a maximum number of computing components within the rack enclosure.

公开(公告)号：US09930802B2

公开(公告)日：2018-03-27

申请号：US15223045

申请日：2016-07-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Arlen L Roesner ,  Dave Mayer

IPC: G06F1/18 ,  H05K7/14

CPC classification number: H05K7/1487 ,  G06F1/183

Abstract: An example device in accordance with an aspect of the present disclosure includes a housing to guide the device for attachment onto a computing system. A board is mounted in the housing and includes a first connector facing along a first direction. A hinge is to enable at least a portion of the board and the first connector to move along the first direction and engage a second connector for installation.

公开(公告)号：US10356964B2

公开(公告)日：2019-07-16

申请号：US15215982

申请日：2016-07-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Elene Chobanyan ,  Karl J. Bois ,  Dave Mayer ,  Arlen L. Roesner

IPC: H05K9/00 ,  H01P1/30 ,  H01P5/02

Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.

公开(公告)号：US20180224910A1

公开(公告)日：2018-08-09

申请号：US15579921

申请日：2015-06-05

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Dave Mayer ,  Steven E. Hanzlik

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02

CPC classification number: G06F1/206 ,  F28D15/0233 ,  G06F1/20 ,  H01L23/427 ,  H05K7/20145 ,  H05K7/20809

Abstract: In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.

公开(公告)号：US20180026325A1

公开(公告)日：2018-01-25

申请号：US15215982

申请日：2016-07-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Elene Chobanyan ,  Karl J. Bois ,  Dave Mayer ,  Arlen L. Roesner

IPC: H01P3/127 ,  H01P1/30 ,  H01P3/12 ,  H05K9/00

CPC classification number: H05K9/0007 ,  H01P1/30 ,  H01P5/024 ,  H05K9/0041

Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.

公开(公告)号：US10455741B2

公开(公告)日：2019-10-22

申请号：US15564826

申请日：2015-04-17

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Dave Mayer ,  Arlen L. Roesner

IPC: H05K7/20 ,  H05K7/14

Abstract: The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consumed by the side plenums may be available to accommodate a chassis of a substantial volume. The chassis may expand a substantial width of the rack enclosure to house an enlarged or a maximum number of computing components within the rack enclosure.

公开(公告)号：US20180035562A1

公开(公告)日：2018-02-01

申请号：US15223045

申请日：2016-07-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Arlen L. Roesner ,  Dave Mayer

IPC: H05K7/14 ,  G06F1/18

CPC classification number: H05K7/1487 ,  G06F1/183

Abstract: An example device in accordance with an aspect of the present disclosure includes a housing to guide the device for attachment onto a computing system. A board is mounted in the housing and includes a first connector facing along a first direction. A hinge is to enable at least a portion of the board and the first connector to move along the first direction and engage a second connector for installation.