A maintenance fixture for PCB′A and an operating method thereof are disclosed to mitigate the problems that the PCB′A may be scrapped upon removing a conductive adhesive. The maintenance fixture includes a cover plate and a support baseplate which is configured to support a PCB′A and provided with a stopper unit; the cover plate is movably connected to the support baseplate at a first end to be rotatable towards and away from the support baseplate, and is provided with a barrier layer at a first side which is perpendicular to the rotation direction and close to the support baseplate; the barrier layer is configured to be contacted with the PCB′A upon the cover plate being rotated towards the support baseplate to cover an electronic component zone and expose an electrode zone of the PCB′A.