Invention Grant
- Patent Title: Bonded filter substrates
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Application No.: US15536130Application Date: 2014-12-19
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Publication No.: US10459174B2Publication Date: 2019-10-29
- Inventor: Sagi Varghese Mathai , Georgios Panotopoulos , Michael Renne Ty Tan , Paul K Rosenberg , Wayne V Sorin
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2014/071367 WO 20141219
- International Announcement: WO2016/099531 WO 20160623
- Main IPC: G02B6/32
- IPC: G02B6/32 ; G02B6/42

Abstract:
In the examples provided herein, an apparatus has a first substrate upon which one or more first filters have been fabricated on a first surface of the first substrate. The apparatus also has a second substrate upon which one or more second filters have been fabricated on a second surface of the second substrate, wherein the one or more first filters and the one or more second filters each transmit a different band of wavelengths. Additionally, the apparatus has a bonding material that bonds the first substrate to the second substrate.
Public/Granted literature
- US20170351041A1 BONDED FILTER SUBSTRATES Public/Granted day:2017-12-07
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