Invention Grant
- Patent Title: Semiconductor package structure
-
Application No.: US15849593Application Date: 2017-12-20
-
Publication No.: US10461035B2Publication Date: 2019-10-29
- Inventor: Shu-Wei Kuo , Wei-Yuan Cheng , Chen-Tsai Yang , Jie-Mo Lin
- Applicant: Industrial Technology Research Institute , Intellectual Property Innovation Corporation
- Applicant Address: TW Hsinchu TW Hsinchu
- Assignee: Industrial Technology Research Institute,Intellectual Property Innovation Corporation
- Current Assignee: Industrial Technology Research Institute,Intellectual Property Innovation Corporation
- Current Assignee Address: TW Hsinchu TW Hsinchu
- Agency: JCIPRNET
- Priority: TW106131708A 20170915
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/14 ; H01L23/15 ; H01L23/31 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L23/498

Abstract:
A semiconductor package structure includes a redistribution structure, a chip, an upper dielectric layer, a plurality of conductive members and an encapsulation layer. The redistribution structure includes a redistribution layer and a first dielectric layer disposed on the redistribution layer. The upper dielectric layer is disposed between the chip and the first dielectric layer of the redistribution structure, wherein the upper dielectric layer and the first dielectric layer are organic materials. A plurality of conductive members is disposed between the redistribution layer and the chip. Each conductive member has a first end adjacent to the chip and a second end adjacent to the redistribution structure, wherein the first end of said each conductive member contacts with the upper dielectric layer and the second end of said each conductive member contacts with the first dielectric layer.
Public/Granted literature
- US20190088600A1 SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2019-03-21
Information query
IPC分类: