- 专利标题： High frequency heating apparatus
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申请号： US13786240申请日： 2013-03-05
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公开(公告)号： US10462856B2公开(公告)日： 2019-10-29
- 发明人: Hoikwan Lee , Kyungmin Yoon , Seo-Yeong Cho
- 申请人： SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
- 申请人地址： KR Asan-si, Chungcheongnam-do
- 专利权人： Corning Precision Materials Co., Ltd.
- 当前专利权人： Corning Precision Materials Co., Ltd.
- 当前专利权人地址： KR Asan-si, Chungcheongnam-do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2012-0022640 20120306
- 主分类号： H05B6/64
- IPC分类号： H05B6/64 ; H05B6/70 ; H05B6/78 ; C03B29/08 ; F27B9/36 ; F27D11/12 ; F27D99/00
摘要：
A high frequency heating apparatus which heats a substrate by applying high frequency waves thereto. The high frequency heating apparatus includes a high frequency generator which generates high frequency to heat the substrate. The distance from the substrate to the high frequency generator is n/2*λ, where n is a natural number ranging from 1 to 6, and λ is the wavelength of the high frequency that is generated by the high frequency generator.
公开/授权文献
- US20130233848A1 HIGH FREQUENCY HEATING APPARATUS 公开/授权日：2013-09-12
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