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    Anti-reflection glass substrate and method for manufacturing same
    3.
    发明授权
    Anti-reflection glass substrate and method for manufacturing same 有权

    公开(公告)号：US10295705B2

    公开(公告)日：2019-05-21

    申请号：US15112113

    申请日：2015-01-05

    申请人： Corning Precision Materials Co., Ltd.

    发明人： Jin Su Nam ,  Seon Ki Kim ,  Jung Keun Oh ,  Su Yeon Lee ,  Myeong Jin Ahn ,  Jae Ho Lee

    IPC分类号： B44C1/22 ,  G02B1/11 ,  G02B1/18 ,  C03C15/00 ,  G02B1/12

    摘要： Provided is an anti-reflection glass substrate comprising an anti-reflection layer having a predetermined thickness from the surface, the anti-reflection glass substrate being characterized in that the anti-reflection layer has at least two layers of a first layer and a second layer successively provided in the depth direction from the surface, each of the first layer and the second layer has a plurality of pores, and the porosity of the first layer is smaller than the porosity of the second layer. In addition, provided is a method for manufacturing an anti-reflection glass substrate, the method successively comprising a step of etching a glass substrate using a first etching liquid and a step of etching the glass substrate using a second etching liquid, the method being characterized in that the molarity of multivalent metal ions of the first etching liquid is larger than the molarity of multivalent metal ions of the second etching liquid. Provided is a method for manufacturing an anti-reflection glass substrate, the method successively comprising a step of etching a glass substrate using a first etching liquid and a step of etching the glass substrate using a second etching liquid, the method being characterized in that the molarity of hydroxides and fluorides of the first etching liquid is smaller than the molarity of hydroxides and fluorides of the second etching liquid.

    Method for manufacturing light extraction substrate for organic light emitting diode, light extraction substrate for organic light emitting diode, and organic light emitting diode comprising same
    4.
    发明授权
    Method for manufacturing light extraction substrate for organic light emitting diode, light extraction substrate for organic light emitting diode, and organic light emitting diode comprising same 有权

    公开(公告)号：US10186685B2

    公开(公告)日：2019-01-22

    申请号：US15539884

    申请日：2015-12-18

    申请人： Corning Precision Materials Co., Ltd.

    发明人： Joo Young Lee

    IPC分类号： H01L51/52 ,  H01L51/56 ,  H01L51/00

    摘要： The present invention relates to a method for manufacturing a light extraction substrate for an organic light emitting diode, a light extraction substrate for an organic light emitting diode, and an organic light emitting diode comprising same, and more specifically, to a method for manufacturing a light extraction substrate for an organic light emitting diode, a light extraction substrate for an organic light emitting diode, and an organic light emitting diode comprising same, capable of significantly increasing light extraction efficiency of the organic light emitting diode. To this end, provided in the present invention is the method for manufacturing the light extraction substrate for the organic light emitting diode, comprising: a mixture-preparing step of preparing a mixture by mixing a sol-gel solution containing a first metal oxide, and a plurality of scattering particles composed of a second metal oxide having a refractive index different from that of the first metal oxide; a mixture coating step of coating the mixture on a base substrate; a mixture firing step of firing the mixture which has been coated to form, on the base substrate, a matrix layer comprising the first metal oxide and inside of which the scattering particles are dispersed; and a filling layer forming step of forming a filling layer by filling the surface of the matrix layer with a material having a refractive index different from that of the matrix layer, wherein the filling layer fills cracks formed on the matrix layer when firing the mixture, and wherein corrugation is formed on the surface of the filling layer by the scattering particles and the shape of the cracks which is transferred onto the surface of the filling layer.

    Organic light emitting diode
    5.
    发明授权
    Organic light emitting diode 有权

    公开(公告)号：US10153458B2

    公开(公告)日：2018-12-11

    申请号：US15539892

    申请日：2015-12-18

    申请人： Corning Precision Materials Co., Ltd.

    发明人： Joo Young Lee ,  Yoon Young Kwon ,  Dong Hyun Kim ,  Seo Hyun Kim

    IPC分类号： H01L51/00 ,  H01L51/52 ,  H01L31/0232 ,  H01L51/50

    摘要： The present invention relates to an organic light emitting diode, and more specifically, to an organic light emitting diode capable of significantly increasing light extraction efficiency through optimization of a corrugated structure, which is formed by being transferred from an inner light extraction layer, thereby enabling excellent light-emitting efficiency. To this end, provided in the present invention is the organic light emitting diode comprising: a first substrate; the inner light emitting layer formed on the first substrate; a first electrode formed on the inner light emitting layer; an organic light emitting layer formed on the first electrode; and a second electrode formed on the organic light emitting layer, wherein corrugation is formed on the surface of the inner light emitting layer, wherein the corrugation is sequentially transferred onto the first electrode, the organic light emitting layer, and the second electrode, and wherein the surface of the second electrode comprises the corrugated structure, wherein the corrugated structure comprises a plurality of convex portions and a plurality of concave portions, which are formed between the convex portions that are adjacent, and wherein the depth/pitch ratio with respect to the pitch between the convex portions that are adjacent and the depth of the concave portions is 0.1 to 7.

    Substrate for integrated circuit package
    6.
    发明授权
    Substrate for integrated circuit package 有权

    公开(公告)号：US10134652B2

    公开(公告)日：2018-11-20

    申请号：US15514753

    申请日：2015-09-18

    申请人： Corning Precision Materials Co., Ltd.

    发明人： Joon Soo Kim ,  Hyung Soo Moon ,  Jae Young Choi

    IPC分类号： H01L23/15 ,  H01L23/00 ,  H01L23/373

    摘要： The present invention relates to a substrate for an integrated circuit package and, more specifically, to a substrate for an integrated circuit package, which reduces mismatch of coefficients of thermal expansion with a semiconductor chip, thereby preventing or minimizing warpage during a reflow process. To this end, the present invention provides a substrate for an integrated circuit package which is interposed between a semiconductor chip and a printed circuit board to electrically connect the semiconductor chip to the printed circuit board, the substrate comprising: an ultra-thin glass; a first CTE control layer which is formed on the upper surface of the ultra-thin glass and formed of a material having a coefficient of thermal expansion different from the coefficients of thermal expansion of the semiconductor chip and the ultra-thin glass; a first metal thin plate which is formed on the upper surface of the first CTE control layer and connected to the semiconductor chip; and a second metal thin plate which is formed on the lower surface of the ultra-thin glass and connected to the printed circuit board.

    Sheet manufacturing method and manufacturing apparatus
    7.
    发明授权
    Sheet manufacturing method and manufacturing apparatus 有权

    公开(公告)号：US10106361B2

    公开(公告)日：2018-10-23

    申请号：US15033983

    申请日：2014-10-30

    申请人： Corning Precision Materials Co., Ltd.

    发明人： Dong Young Cho ,  Ki Nam Kim ,  Shin Kim ,  Mun Hwan Seol

    IPC分类号： B65H35/04 ,  C03B33/023

    摘要： The present invention provides a sheet manufacturing method comprising: an unwinding step of supplying an object from a roll on which the object is wound; a feeding step of feeding the supplied object; and a cutting step of cutting the fed object, wherein the cutting comprises sheet-cutting in which the object is cut in the width direction of the object. Further, the present invention provides a sheet manufacturing apparatus comprising: an unwinding part for supplying an object from a roll on which the object is wound; a feeding part for feeding the supplied object; and a cutting part for the fed object, wherein the cutting comprises sheet-cutting in which the object is cut in the width direction of the object.

    Integrated circuit package substrate
    9.
    发明授权
    Integrated circuit package substrate 有权

    公开(公告)号：US10026683B2

    公开(公告)日：2018-07-17

    申请号：US15562863

    申请日：2016-04-06

    申请人： CORNING PRECISION MATERIALS CO., LTD.

    发明人： Hyun Hang Park ,  Bo Gyeong Kim ,  Hyun Bin Kim ,  Sung Hoon Lee

    IPC分类号： H01L23/498

    摘要： The present invention relates to an integrated circuit package substrate and, more specifically, to an integrated circuit package substrate, which exhibits excellent conductivity and reliability through the improvement of an adhesive force between a metal line for electrically connecting an upper part and a lower part of the integrated circuit package substrate and glass formed inside the integrated circuit package substrate. To this end, the present invention provides the integrated circuit package substrate comprising: a core part made of glass; a first metal thin plate formed on the upper part of the core part and made of Cu; a second metal thin plate formed at the lower part of the core part and made of Cu; a metal line formed in a shape in which the metal line penetrates through the first metal thin plate, the core part, and the second metal thin plate so as to electrically connect the first metal thin plate and the second metal thin plate, and made of Cu; and an intermediate layer formed on the outer circumferential surface of the metal line, wherein the intermediate layer includes any one of Cu2O, Cu2O doped with a transition metal, and a metal oxide including Cu and a transition metal.