Invention Grant
- Patent Title: Cooling electronic devices in a data center
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Application No.: US14747448Application Date: 2015-06-23
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Publication No.: US10462935B2Publication Date: 2019-10-29
- Inventor: Soheil Farshchian , Kenneth Dale Shaul
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Fish & Richardson P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; H01L23/473

Abstract:
A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
Public/Granted literature
- US20160381839A1 COOLING ELECTRONIC DEVICES IN A DATA CENTER Public/Granted day:2016-12-29
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