公开(公告)号：US20220007547A1

公开(公告)日：2022-01-06

申请号：US16919270

申请日：2020-07-02

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Angela Ying-Ju Chen ,  Winnie Leung ,  Pascal C. Kam ,  Kenneth Dale Shaul

IPC: H05K7/20 ,  H05K7/14

Abstract: A kit for forming a data center comprising a first rack, a second rack, a first support having a first end and a second end opposite the first end, the first support configured to be secured to the floor at the first end, a cooling frame having a cooling unit received therein, the cooling frame having a first face and a second face opposite the first face, the cooling frame configured to be secured to the second end of the first support, a first distribution frame having a first plurality of support arms extending therefrom, the first distribution frame configured to be coupled to the first face of the cooling frame, and a second distribution frame having a second plurality of support arms extending therefrom, the second distribution frame configured to be coupled to the second face of the cooling frame.

公开(公告)号：US20190037729A1

公开(公告)日：2019-01-31

申请号：US16150842

申请日：2018-10-03

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

公开(公告)号：US11622474B2

公开(公告)日：2023-04-04

申请号：US17835487

申请日：2022-06-08

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Kenneth Dale Shaul

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/473 ,  G06F1/20

Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

公开(公告)号：US20220304195A1

公开(公告)日：2022-09-22

申请号：US17835487

申请日：2022-06-08

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Kenneth Dale Shaul

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/473 ,  G06F1/20

Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

公开(公告)号：US11419246B2

公开(公告)日：2022-08-16

申请号：US16575953

申请日：2019-09-19

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Kenneth Dale Shaul

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/473 ,  G06F1/20

Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

公开(公告)号：US10785895B2

公开(公告)日：2020-09-22

申请号：US15724923

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US11109517B2

公开(公告)日：2021-08-31

申请号：US16555562

申请日：2019-08-29

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Madhu Krishnan Iyengar

IPC: H05K7/20 ,  G06F1/20

Abstract: A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

公开(公告)号：US10462935B2

公开(公告)日：2019-10-29

申请号：US14747448

申请日：2015-06-23

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Kenneth Dale Shaul

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/473

Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

公开(公告)号：US10448543B2

公开(公告)日：2019-10-15

申请号：US14703566

申请日：2015-05-04

Applicant: Google LLC

Inventor： Soheil Farshchian ,  Madhu Krishnan Iyengar

IPC: H05K7/20 ,  F28D15/00 ,  G06F1/20

Abstract: A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

公开(公告)号：US10412854B1

公开(公告)日：2019-09-10

申请号：US14853561

申请日：2015-09-14

Applicant: Google LLC

Inventor： Kenneth Dale Shaul ,  Thomas R. Kowalski ,  Gary Joseph Hensley ,  Soheil Farshchian ,  Pascal Kam

IPC: H05K7/14 ,  H05K7/18

Abstract: A server rack seismic restraint includes a rear restraint assembly configured to attach to a support surface that is operable to support a data center server rack. The rear restraint assembly includes at least one lateral member positioned to receive the server rack and restrain the server rack against lateral movement based on a force applied to the server rack; and an angled bracket positioned to receive the server rack and restrain the server rack against vertical movement based on the force applied to the server rack. The server rack seismic restraint also includes a front restraint assembly configured to attach to the support surface and engage the server rack to restrain the server rack against vertical movement based on the force applied to the server rack.