Invention Grant
- Patent Title: Hermetically-sealed package and method of forming same
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Application No.: US15477904Application Date: 2017-04-03
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Publication No.: US10463285B2Publication Date: 2019-11-05
- Inventor: Mark R Boone , Jonathan L Kuhn
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61B5/1455
- IPC: A61B5/1455 ; F21V31/00 ; A61B5/00 ; A61B5/145 ; F21V9/00 ; F21V3/00 ; F21V23/06 ; A61B5/024 ; A61B5/026 ; A61B5/08 ; A61N1/39 ; A61N1/05 ; A61N1/375 ; F21Y115/10

Abstract:
Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.
Public/Granted literature
- US20180279932A1 HERMETICALLY-SEALED PACKAGE AND METHOD OF FORMING SAME Public/Granted day:2018-10-04
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