Invention Grant
- Patent Title: Nozzle for uniform plasma processing
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Application No.: US14461318Application Date: 2014-08-15
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Publication No.: US10465288B2Publication Date: 2019-11-05
- Inventor: Rohit Mishra , Siva Suri Chandra Rao Bhesetti , Eng Sheng Peh , Sriskantharajah Thirunavukarasu , Shoju Vayyapron , Cheng Sun
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: C23C16/50
- IPC: C23C16/50 ; H01J37/32 ; C23C16/455
Abstract:
A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.
Public/Granted literature
- US20160047040A1 NOZZLE FOR UNIFORM PLASMA PROCESSING Public/Granted day:2016-02-18
Information query
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