Invention Grant
- Patent Title: Adhesion-promoting surface
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Application No.: US15674618Application Date: 2017-08-11
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Publication No.: US10465308B2Publication Date: 2019-11-05
- Inventor: Peter Mardilovich , Anthony M. Fuller , Qingqiao Wei
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: C25D1/00
- IPC: C25D1/00 ; C25D11/04 ; C25D11/12 ; C25D11/24 ; C23C28/00

Abstract:
A method of adhering a cover layer to a substrate includes forming an array of nano-structures on a substrate. A flowable material is applied to the substrate, the flowable material substantially enveloping the nano-structures on the substrate. The flowable material is solidified to form a cover layer on the substrate, the cover layer being anchored to the substrate via the nano-structures.
Public/Granted literature
- US20170342580A1 ADHESION-PROMOTING SURFACE Public/Granted day:2017-11-30
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