Invention Grant
- Patent Title: System on a chip comprising multiple compute sub-systems
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Application No.: US14578004Application Date: 2014-12-19
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Publication No.: US10469403B2Publication Date: 2019-11-05
- Inventor: Mark Bradley Davis , David James Borland
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H04L12/911
- IPC: H04L12/911 ; G06F12/0811 ; G06F13/40 ; H04L29/08 ; G06F15/78 ; H04L12/933

Abstract:
Embodiments can provide additional computing resources at minimal and incremental cost by providing instances of one or more server compute subsystems on a system-on-chip. The system-on-chip can include multiple compute subsystems where each compute subsystem can include dedicated processing and memory resources. The system-on-chip can also include a management compute subsystem that can manage the processing and memory resources for each subsystem.
Public/Granted literature
- US10523585B2 System on a chip comprising multiple compute sub-systems Public/Granted day:2019-12-31
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