Invention Grant
- Patent Title: Camera module having baffle between two glass substrates
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Application No.: US15585483Application Date: 2017-05-03
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Publication No.: US10469718B2Publication Date: 2019-11-05
- Inventor: Tsung-Wei Wan , Wei-Ping Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B17/08 ; G02B23/24 ; G02B13/00 ; A61B1/00

Abstract:
A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.
Public/Granted literature
- US20180324336A1 CAMERA MODULE HAVING BAFFLE BETWEEN TWO GLASS SUBSTRATES Public/Granted day:2018-11-08
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