Invention Grant
- Patent Title: Polishing apparatus for a work with mechanical polishing function and chemical polishing function
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Application No.: US15224064Application Date: 2016-07-29
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Publication No.: US10471565B2Publication Date: 2019-11-12
- Inventor: Kazutaka Shibuya , Yoshio Nakamura
- Applicant: FUJIKOSHI MACHINERY CORP.
- Applicant Address: JP Nagano-Shi, Nagano
- Assignee: FUJIKOSHI MACHINERY CORP.
- Current Assignee: FUJIKOSHI MACHINERY CORP.
- Current Assignee Address: JP Nagano-Shi, Nagano
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2014-051394 20140314
- Main IPC: B24B37/04
- IPC: B24B37/04 ; H01L21/306 ; B24B57/02 ; C23F1/08 ; C23F1/12 ; C23F1/14 ; H01L21/67 ; H01J37/32 ; H01L21/02 ; H01L29/16 ; H01L29/20
Abstract:
The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
Public/Granted literature
- US20160332278A1 METHOD FOR POLISHING WORK AND WORK POLISHING APPARATUS Public/Granted day:2016-11-17
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